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| Acceleration | Helium Leak Testing on Components |
| Atmosphere/Altitude to 80,000 ft. | HAST Testing |
| Barometric Pressure Testing | Humidity Test |
| Bond Pull | Immersion |
| Burn-in Testing to +200 Deg C | Industrial Temperature Testing |
| Capacitance Testing | Lead Forming |
| Centrifuge | Marking |
| Class S Testing for Space | Non-Destructive Testing |
| Clean Room Microelectronic Packaging | PIND Particle Impact Noise Detection |
| Commercial Testing | Qualification Testing |
| Cross Sectioning | Recertification |
| Custom Hardware/Software | Reliability Testing |
| Custom IC & Transistor Packaging | Power Burn-In |
| Destructive Testing | Radiography |
| Die Qualification | Resistance to Solvents |
| Die Shear Strength Test up to 5.0 Kg | SEM Analysis - Scanning Electron Microscope |
| Destructive Physical Analysis - DPA on Components | Salt Spray |
| Dust Testing | Serialize Components |
| EDAX | Shock Testing |
| Electrical Characteristics | Solderability Testing |
Electrical Testing:
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Space Level Testing |
| Element Evaluation | Temperature Cycling (-200°C to +200°C) |
| Environmental Stress Screening | Thermal Shock Testing (+200°C) |
| Environmental Testing | Upscreening |
| Equivalent screening for JAN thru JANS | Vibration Testing - Up to 500 lb. |
| Failure Analysis | Wafer Probing |
| Fine & Gross Leak Testing | X-Ray |
| Fungus Test | |
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MIL-STD-883 TESTS
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TEST |
METHOD |
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Bond Strength |
2011 |
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Burn-in |
2025 |
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Constant Acceleration/Centrifuge |
2001 |
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Die Shear |
2019 |
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Die Penetrant |
1034 |
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External Visual |
2009 |
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Internal Visual, Hybrid |
2017 |
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Internal Visual inspection for DPA |
2013 |
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Internal Visual Mechanical |
2014 |
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Internal Visual Monolithic |
2010 |
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Lead integrity |
2004 |
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Lead Pull for PG |
2028 |
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Lid Torque |
2024 |
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Mechanical Shock |
2002 |
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Moisture Resistance |
1004 |
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Non-destructive Bond Pull |
2023 |
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Physical Dimensions |
2016 |
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PIND-Particle Impact Noise Detection |
2020 |
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Qualification and Quantity Conformance Inspection |
5005 |
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Resistance to Solvents |
2015 |
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Salt Atmosphere |
1009 |
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Screening |
5004 |
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Seal - Leak Test |
1014 |
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Solderability |
2003 |
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Stabilization Bake |
1008 |
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Steady State Life |
1005 |
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Temperature Cycling |
1010 |
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Thermal Shock |
1011 |
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Vibration Variable Frequency |
2007 |
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TEST LABS, INC. |
|
15849 Business Ctr Dr. |
|
Irwindale, Ca. 91706-2053 U.S.A. |
|
TOLL FREE 800.729.8378 |
|
Phone: 626.962.7166 Fax: 626.960.6896 |
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