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Electronic Component Assembly

Manufacturing

  • Certified Class 10,000 Clean Room
  • Custom Microelectronic Packaging
  • Obsolete Integrated Circuits
  • Obsolete Transistors part numbers 2N6116, 2N6117, 2N6118 and more!!
  • Printed Circuit Boards for Space Flight Hardware (Satellites)

All assembly to applicable MIL Specifications


Integrated Circuit Packaging

  • Ceramic - DIP, FP, QFP, LCC, SOIC, PLCC, Etc....
  • Die Attach
  • Wire Bonding
  • Metal - DIP, FP, QFP, TO
  • Plastic - Thermoplastics

Custom Microelectronic Packaging

  • Custom Hybrid Microcircuits, Optoelectronics, Fiber Optics, SMT, Monolithics, Obsoletes, Custom ASICs

Tandex Custom Hybrid Microcircuit Packaging

Boards:

  • Chip-On-Board (C.O.B.) Synthetic
  • P.C.B and P.W.B
  • Surface Mount, Ceramic

Hybrid Microelectronics:

  • Single Layer
  • Multi-Layered

Prototype:

  • Complete Management for "Turn-Key Solutions"


Tandex Materials Management

Procurement, Inspection, Test, Analyze and Certify to Specifications on Schedule. Turn Key Operations for Space Hardware.

TAPE and REEL

  • Surface Mount, SOIC, SOJ, PLCC, QSOP, TSOP,QFP, SOT & BGA.
  • Radial Tape and Reel
  • Axial Tape and Reel
  • De-Tape
  • Lead Forming and Trimming
  • Full ESD Protection
  • 100% Visual Incoming Inspection
  • 100% Count Verification

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Tandex Test Labs Home

TEST LABS, INC.

15849 Business Ctr Dr.

Irwindale, Ca. 91706-2053 U.S.A.

TOLL FREE 800.729.8378

Phone: 626.962.7166 Fax: 626.960.6896

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