Tandex is pleased to announce the addition of the ESEC Wire Bonder To our family
In our clean room, the ESEC 3018 has taken precedence in allowing Tandex to manufacture custom microelectronics with our new Automated Gold Ball Bonder. Contact Tandex for any of your special needs to have parts built per your spec.
Integrated Circuit Packaging
Custom Microelectronic Packaging
Procurement, Inspection, Test, Analyze and Certify to Specifications on Schedule. Turn Key Operations for Space Flight Hardware.
TAPE and REEL
- Surface Mount, SOIC, SOJ, PLCC, QSOP, TSOP,QFP, SOT & BGA.
- Radial Tape and Reel
- Axial Tape and Reel
- Lead Forming and Trimming
- Full ESD Protection
- 100% Visual Incoming Inspection
- 100% Count Verification
TEST LABS, INC.
15849 Business Ctr Dr.
Irwindale, Ca. 91706-2053 U.S.A.
TOLL FREE 800.729.8378
Phone: 626.962.7166 Fax: 626.960.6896
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Integrated Circuit Packaging Die Attach Wire Bond Integrated Circuit Packaging Die Attach Wire Bond hip Level Packaging Vacuum Bake Integrated Circuit Packaging Bond pull Die Attach Chip Level Packaging Electronics Reliability testing Integrated Circuit Packaging Internal Visual Inspection Semiconductor Manufacturing Die Attach Semiconductor Manufacturing and Chip Level Packaging and Die Attach we also do Vacuum Bake Internal Visual Inspection, Bond pull Electronics Reliability testing Semiconductor Manufacturing, Wire Bonding and Semiconductor Manufacturing Vacuum Bake Wire Bond Vacuum Bake chip level packaging semiconductor manufacturing Electronics Reliability Internal Visual Inspection Vacuum Bake Chip Level Packaging Bond pull Die Attach Wire Bond Internal Visual Inspection Electronics Reliability testing Vacuum Bake Semiconductor Manufacturing and Wire Bonding at Tandex in Irwindale.