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Manufacturing
- Certified Class 10,000 Clean Room
- Custom Microelectronic Packaging
- Obsolete Integrated Circuits
- Obsolete Transistors part numbers 2N6116, 2N6117, 2N6118 and more!!
- Printed Circuit Boards for Space Flight Hardware (Satellites)
- Epoxy / Eutectic / Solder Die Attach
- Die Shear
- Visual Inspection
- Gold / Aluminum Wire Bond
- Bond Pull
Integrated Circuit Packaging
- Ceramic - DIP, FP, QFP, LCC, SOIC, PLCC, Etc....
- Die Attach
- Die Packaging
- Wire Bonding
- Metal - DIP, FP, QFP, TO
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Plastic - Thermoplastics
Custom Microelectronic Packaging
- Custom Hybrid Microcircuits, Optoelectronics, Fiber Optics, SMT, Monolithics, Obsoletes, Custom ASICs
Boards:
- Chip-On-Board (C.O.B.) Synthetic
- P.C.B and P.W.B
- Surface Mount, Ceramic
Hybrid Microelectronics:
- Single Layer
- Multi-Layered
- Hermetic Sealing
- Chip Level Packaging
- Surface Mount Technology
Prototype:
- Complete Management for "Turn-Key Solutions"
Procurement, Inspection, Test, Analyze and Certify to Specifications on Schedule. Turn Key Operations for Space Hardware.
TAPE and REEL
- Surface Mount, SOIC, SOJ, PLCC, QSOP, TSOP,QFP, SOT & BGA.
- Radial Tape and Reel
- Axial Tape and Reel
- De-Tape
- Lead Forming and Trimming
- Full ESD Protection
- 100% Visual Incoming Inspection
- 100% Count Verification
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TEST LABS, INC. |
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15849 Business Ctr Dr. |
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Irwindale, Ca. 91706-2053 U.S.A. |
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TOLL FREE 800.729.8378 |
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Phone: 626.962.7166 Fax: 626.960.6896 |
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Services - Quality - Links/Specs - Tour - Newsletter - Map - E-Mail |
Integrated Circuit Packaging Die Attach Wire Bond Integrated Circuit Packaging Die Attach Wire Bond hip Level Packaging Vacuum Bake Integrated Circuit Packaging Bond pull Die Attach Chip Level Packaging Electronics Reliability testing Integrated Circuit Packaging Internal Visual Inspection Semiconductor Manufacturing Die Attach Semiconductor Manufacturing and Chip Level Packaging and Die Attach we also do Vacuum Bake Internal Visual Inspection, Bond pull Electronics Reliability testing Semiconductor Manufacturing, Wire Bonding and Semiconductor Manufacturing Vacuum Bake Wire Bond Vacuum Bake chip level packaging semiconductor manufacturing Electronics Reliability Internal Visual Inspection Vacuum Bake Chip Level Packaging Bond pull Die Attach Wire Bond Internal Visual Inspection Electronics Reliability testing Vacuum Bake Semiconductor Manufacturing and Wire Bonding also Internal Visual Inspection offered as well as Vacuum Bake at Tandex.